ASUS ROG Maximus XIII Hero (WiFi 6E) Z590 LGA 1200 (Intel 11th/10th Gen) ATX Gaming Motherboard (PCIe 4.0, 14+2 Power Stages, DDR4 5333+, Dual 2.5Gb LAN, Thunderbolt 4 Onboard, Bluetooth v5.2, Quad M.2/NVMe SSD, Aura RGB Lighting)
Pick up from the Aliteq Store
To pick up today from our store at Newroad, Kathmandu, Nepal.
Free
Courier delivery
Our courier will deliver to the specified address
2-3 Days
Variable
Air Delivery
Receive your products from our store within 24 hours for delivery to your nearest airport.
24 Hours
Variable
Warranty 1 year
Free 30-Day returns
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Intelligent Motherboard
Intelligent software solutions help ensure that your system performs at its best. The latest ASUS AI-powered enhancements span four pillars of performance, including overclocking, cooling, networking and onboard audio, making advanced tweaks and optimization accessible to new recruits and savvy PC DIY veterans alike.
Tuning is now faster and smarter than ever before. ASUS AI Overclocking profiles the CPU and cooling to predict the optimal configuration and push each system to its limits.
Balance the thermals and acoustics of any build with a single click. A proprietary ASUS algorithm reduces unnecessary system noise by monitoring CPU temperatures and dynamically adjusting fans to optimal speeds.
GameFirst VI optimizes networking performance by allocating bandwidth in real-time based on application usage scenarios and corresponding learning algorithms.
This utility leverages a massive deep-learning database to reduce over 500 million types of background noise from incoming or outgoing audio, helping ensure crystal-clear communication in games or calls.
A VRM heatsink on the MOSFETs and chokes is connected to the aluminum I/O cover via an embedded heatpipe to increase mass and surface area for dissipation.
Quad dedicated heatsinks keep up to four M.2 drives at the optimum operating temperature for consistent performance and reliability.
An L-shaped Heatpipe allows for rapid and even heat transfer from the VRM.
A high-quality thermal pad improves overall heat transfer from the system by bridging the heat generated by the power stages to the heatsink.
All M.2 slots feature backplate blocks that ensure high-performance drives deliver peak performance even when airflow is restricted.
A dedicated chipset heatsink draws heat away to maintain optimum operating temperatures.
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